Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars Effectively

Product Details
Customization: Available
After-sales Service: One Year
Warranty: One Year
Manufacturer/Factory & Trading Company
Diamond Member Since 2024

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  • Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars Effectively
  • Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars Effectively
  • Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars Effectively
  • Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars Effectively
  • Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars Effectively
  • Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars Effectively
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Basic Info.

Model NO.
CHTXQ-690F
Type
CNC Cutting Machine
Usage
Ceramics, Glass, Jadestone, Granite, Marble
Application
Art & Craft, Construction, Mineral Industry, Stone Industry
Source Voltage
380V
Automation
Automatic
Cutting Ability
High Speed
Control
CNC
Certification
CCC, ISO, CE
Transport Package
Package
Specification
1830*2800*2650mm
Trademark
ChangTong
Origin
China
HS Code
84649010

Product Description

Equipment Use: Step into the future of precision cutting with our state-of-the-art machine, expertly crafted to maximize efficiency for our most discerning clientele. This cutting-edge equipment boasts an impressive roller length of 690mm and a versatile table size measuring 170/145mm*690mm*160mm*2, masterfully handling precise cuts for products with thicknesses as delicate as 0.3mm and as robust as 65mm.
Introducing the CHTXQ-690F Double Plate Multi-Wire Cutting Machine - Product Features

1. Experience groundbreaking innovation with our design that employs four motors, each independently driving a roller to act as a dynamic drive shaft. This ingenious setup minimizes wear on the steel line against the roller, significantly extending the lifespan of the rollers. The roller bracket, crafted with processing center molding, guarantees flawless spindle installation and impeccable coaxial alignment.
2. The machine is equipped with a sophisticated LED display that provides cutting data insights with stunning clarity, enhancing operational efficiency at every step.
3. Our revolutionary under-table design enables materials to be cut from beneath, greatly simplifying the loading and unloading process for an uninterrupted and seamless operation.
4. Choose from our two distinct models: high-speed and standard. The high-speed variant outpaces the standard with its accelerated line speeds, boosting cutting efficiency and allowing for the use of thinner diamond lines for identical cuts.
5. The table's ability to move transversely offers the flexibility of back-and-forth motion, which is ideal for tile cutting, and delivers advanced single-line cutting capabilities.
6. With its expansive loading area of 170/145mm*690mm*160mm*2, this machine takes cutting efficiency to new heights, accommodating larger material volumes with ease.
7. Featuring spindle precision at an extraordinary ≤0.01mm and proprietary dust technology (Pat. No. ZL201320681902.7), this machine promises stable operations and hassle-free disassembly, ensuring top performance.
8. Designed for user-friendliness, this machine includes an automatic lifting shield and a fully expandable workbench, which streamline the process of loading and unloading materials and rollers, making operations smooth and effortless.
  unit parameter
Maximum Worksize mm 170/145*690*160*2
cutting thickness mm 0.6~65
running speed m/min 0~2200
Table lift stroke mm 220
Table cutting feed speed mm/hour 0.1~100
The amount of wire output from the supply wheel Km 30(φ0.2diamond wire)
Diamond diameter mm φ0.06~φ0.35axle
Roller outside diameter*number of axles mm φ155/φ180*690*4
boundary dimension mm ≈1830*2800*2650
machine weight Kg 6500~115000
power   AC380V/50HZ  three-phase four-wire
Total machine power rating Kw 54 above
Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars Effectively
This machine stands out as a double-station multi-wire cutting wonder, leveraging diamond wire to process two plate materials simultaneously. It features a roller length of 690mm and a maximum cutting area of 220mm*690mm*160mm*2. Perfectly suited for single and multi-line cutting of hard and brittle materials, it accommodates blade thicknesses from 0.5mm to 65mm.
Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars EffectivelyThis model is a top-tier multi-line cutting machine tailored for diamond line processing, showcasing a roller length of 570mm and a maximum cutting area of 220mm*570mm*160mm. It excels at slicing products with thicknesses ranging from 0.3mm to 65mm, making it ideal for straight sheet processing of hard and brittle materials.
Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars Effectively
Crafted as a compact multi-line cutting solution, this model is perfect for small batch product processing. With options for single or double stations, it eases specification changes and supports cutting thicknesses from 0.5mm to 30mm, perfectly suited for single and multi-line cutting needs of small batches of hard and brittle materials.
Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars Effectively




>Stable Wire Web Control
Our cone-positioned structural design ensures that rollers and wire spools deliver exceptional accuracy and rigidity, reducing wire web vibrations to maintain unparalleled stability.
>Optimized Pulley System
Engineered with 8 pulleys, our system effectively minimizes diamond wire torsion, tension fluctuations, and wire breakage, significantly enhancing durability and overall performance.
>Easy Wire Winding
The wire pay-off wheel adopts the standard universal spool (PV600 reinforced I-wheel), eliminating the hassle of rewinding, offering unmatched convenience and efficiency.
>Safety Guarantee
With an electric lift and a strong safety device on the main operation door, our design ensures secure and accessible operation, prioritizing safety at every turn.
>Wire Break Memory System.

>Easy Operation
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Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars EffectivelyEfficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars Effectively
Efficient Diamond Wire Cutting Machine for Cutting Semiconductor Bars Effectively

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