Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar Cutting

Product Details
Customization: Available
After-sales Service: One Year
Warranty: One Year
Manufacturer/Factory & Trading Company
Diamond Member Since 2024

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  • Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar Cutting
  • Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar Cutting
  • Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar Cutting
  • Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar Cutting
  • Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar Cutting
  • Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar Cutting
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Basic Info.

Model NO.
CHTXQ-690F
Usage
Ceramics, Glass, Jadestone, Granite, Marble
Application
Art & Craft, Construction, Mineral Industry, Stone Industry
Source Voltage
380V
Automation
Automatic
Cutting Ability
High Speed
Control
CNC
Certification
CCC, ISO, CE
Transport Package
Package
Specification
1830*2800*2650mm
Trademark
ChangTong
Origin
China
HS Code
84649010

Product Description

Equipment Use: This precision-engineered marvel has been crafted to maximize cutting efficiency for the most discerning clientele. Boasting an impressive roller length of 690mm and a highly adaptable table size of 170/145mm*690mm*160mm*2, it handles the precise cutting of products with thicknesses from an ultra-thin 0.3mm to a substantial 65mm with unparalleled finesse.
Introducing the CHTXQ-690F Double Plate Multi-Wire Cutting Machine - Unparalleled Product Features

1. With its groundbreaking design, the four motors independently animate each roller, effectively transforming them into dynamic drive shafts. This reduces wear and tear, enhancing durability and longevity of the roller. Its roller bracket, expertly shaped by a processing center mold, assures perfect spindle installation and flawless coaxial alignment.
2. Outfitted with an intuitive LED display, this cutting-edge machine offers precise and clear cutting data insights, boosting operational productivity and efficiency.
3. The ingenious under-table configuration ensures materials can be cut from the bottom up, streamlining the loading and unloading process for a smooth and seamless operation.
4. Available in two distinct models: high-speed and standard. The high-speed variant outpaces the standard model with increased line speeds and enhanced cutting efficiency, allowing the use of even thinner diamond lines for similar material cuts.
5. Its versatile table, capable of transverse movement, allows for back-and-forth motion. This facilitates tile cutting and provides a state-of-the-art single-line cutting capability.
6. Featuring a vast loading area of 170/145mm*690mm*160mm*2, this machine dramatically boosts cutting efficiency, accommodating larger volumes of material.
7. With spindle accuracy finely tuned to an impressive ≤0.01mm and featuring patented dust structure technology (Pat. No. ZL201320681902.7), it guarantees stable performance and effortless disassembly.
8. Designed for ease of use, it includes an automatic lifting shield and a fully expandable workbench, simplifying the processes of material and roller loading and unloading.
  unit parameter
Maximum Worksize mm 170/145*690*160*2
cutting thickness mm 0.6~65
running speed m/min 0~2200
Table lift stroke mm 220
Table cutting feed speed mm/hour 0.1~100
The amount of wire output from the supply wheel Km 30(φ0.2diamond wire)
Diamond diameter mm φ0.06~φ0.35axle
Roller outside diameter*number of axles mm φ155/φ180*690*4
boundary dimension mm ≈1830*2800*2650
machine weight Kg 6500~115000
power   AC380V/50HZ  three-phase four-wire
Total machine power rating Kw 54 above
Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar Cutting
This machine stands out as a double-station multi-wire cutting powerhouse, utilizing diamond wire for superior processing. It skillfully manages two plate materials simultaneously, with a roller length of 690mm and a maximum cutting area of 220mm*690mm*160mm*2. For hard and brittle materials, it offers both single and multi-line cutting with blade thicknesses from 0.5mm to 65mm.
Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar CuttingA high-performance multi-line cutting machine, this model is engineered for diamond wire processing, featuring a roller length of 570mm and a maximum cutting area of 220mm*570mm*160mm. It is adept at slicing products with thicknesses ranging from 0.3mm to 65mm, excelling in processing hard and brittle materials with precision.
Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar Cutting
Compact and engineered for excellence, this multi-line cutting solution is tailored for small batch product processing. With options for single or double stations, it simplifies specification changes and accommodates cutting thicknesses from 0.5mm to 30mm, making it ideal for single and multi-line cutting of small batches of challenging materials.
Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar Cutting




>Stable Wire Web Control
Featuring a cone-positioned structural design, the rollers and wire spools deliver unmatched accuracy and rigidity, minimizing vibrations to ensure wire web stability.
>Optimized Pulley System
Ingeniously designed with 8 pulleys, this system remarkably reduces diamond wire torsion, tension fluctuations, and wire breakage, significantly enhancing durability and performance.
>Easy Wire Winding
The wire pay-off wheel, utilizing the standard universal spool (PV600 reinforced I-wheel), eliminates the need for rewinding, providing unmatched convenience and efficiency.
>Safety Guarantee
An electric lift equips the main operation door with a robust safety device, ensuring secure and accessible operation for peace of mind.
>Wire Break Memory System.

>Easy Operation
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Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar CuttingReliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar Cutting
Reliable Diamond Wire Cutting Machine for High-Precision Semiconductor Bar Cutting

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