Precision Bar Cutting System for Efficient Semiconductor Cutter Applications

Product Details
Customization: Available
After-sales Service: One Year
Warranty: One Year
Manufacturer/Factory & Trading Company
Diamond Member Since 2024

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  • Precision Bar Cutting System for Efficient Semiconductor Cutter Applications
  • Precision Bar Cutting System for Efficient Semiconductor Cutter Applications
  • Precision Bar Cutting System for Efficient Semiconductor Cutter Applications
  • Precision Bar Cutting System for Efficient Semiconductor Cutter Applications
  • Precision Bar Cutting System for Efficient Semiconductor Cutter Applications
  • Precision Bar Cutting System for Efficient Semiconductor Cutter Applications
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Basic Info.

Model NO.
CHTXQ-690F
Type
CNC Cutting Machine
Usage
Ceramics, Glass, Jadestone, Granite, Marble
Application
Art & Craft, Construction, Mineral Industry, Stone Industry
Source Voltage
380V
Automation
Automatic
Cutting Ability
High Speed
Control
CNC
Certification
CCC, ISO, CE
Transport Package
Package
Specification
1830*2800*2650mm
Trademark
ChangTong
Origin
China
HS Code
84649010

Product Description

Equipment Use: Meticulously crafted for superior cutting prowess, this state-of-the-art model features an expansive roller length of 690mm and is precisely configured with a substantial table size of 170/145mm*690mm*160mm*2. It excels at slicing products with a variable thickness ranging from 0.3mm to 65mm, positioning it as the quintessential choice for intricate and precise cutting applications.
CHTXQ-690F Double Plate Multi-Wire Cutting Machine - Product Features

1. Boasting four independently driven motors, each managing its own roller, this sophisticated design dramatically reduces steel line wear and amplifies roller durability. The precision-crafted roller bracket mounting holes guarantee flawless spindle alignment for uninterrupted and seamless operations.
2. Outfitted with an advanced LED display, this machine provides cutting data with pinpoint accuracy, making interpretation effortless.
3. The distinctive bottom-up material feeding system facilitates easy loading and unloading, effectively optimizing the entire cutting process.
4. Available in high-speed and standard variants, the high-speed version enhances line speed and cutting efficiency, thus accommodating the use of more delicate diamond lines.
5. With its transverse movement feature, the versatile table is capable of moving back and forth, allowing for both tile cutting and single-line cutting functions.
6. With an expansive loading area of 170/145mm*690mm*160mm*2, this machine substantially elevates cutting efficiency.
7. The spindle precision is reliably maintained at ≤0.01mm. Its patented dust-proof structural design (Patent No. ZL201320681902.7) guarantees stability and ease of maintenance.
8. Intuitive and efficient, this machine features an automatic lifting shield and a fully expanded workbench, significantly simplifying material and roll handling.
  unit parameter
Maximum Worksize mm 170/145*690*160*2
cutting thickness mm 0.6~65
running speed m/min 0~2200
Table lift stroke mm 220
Table cutting feed speed mm/hour 0.1~100
The amount of wire output from the supply wheel Km 30(φ0.2diamond wire)
Diamond diameter mm φ0.06~φ0.35axle
Roller outside diameter*number of axles mm φ155/φ180*690*4
boundary dimension mm ≈1830*2800*2650
machine weight Kg 6500~115000
power   AC380V/50HZ  three-phase four-wire
Total machine power rating Kw 54 above
Precision Bar Cutting System for Efficient Semiconductor Cutter Applications
This cutting-edge double-station multi-wire cutting machine is equipped with diamond wire processing, empowering operators to process two plate materials per cycle. It boasts a roller length of 690mm and a cutting area of 220mm*690mm*160mm*2. The innovative rotary tool holder allows cutting blade thicknesses from 0.5mm to 65mm, offering both single-line and multi-line cutting for hard and brittle materials.
Precision Bar Cutting System for Efficient Semiconductor Cutter ApplicationsThis model is ingeniously designed as a multi-line cutting machine with diamond line processing, featuring a roller length of 570mm and a maximum cutting area of 220mm*570mm*160mm. Its rotary tool holder is perfectly suited for cutting products with thicknesses spanning from 0.3mm to 65mm, rendering it ideal for bulk processing of hard and brittle sheets.
Precision Bar Cutting System for Efficient Semiconductor Cutter Applications
This compact, multi-line cutting machine, offered in both single and double station models, is expertly crafted for small batch straight sheet processing. Its flexibility allows for quick and easy specification adjustments, accommodating cutting sheet thicknesses from 0.5mm to 30mm, and supporting both single and multi-line functionalities for small batches of hard and brittle materials.
Precision Bar Cutting System for Efficient Semiconductor Cutter Applications




>Stable Wire Web Control
Revolutionary cone-positioned rollers and wire spools deliver unparalleled accuracy and rigidity, markedly reducing wire web oscillation.
>Optimized Pulley System
An innovative 8-pulley system significantly diminishes diamond wire torsion, tension fluctuation, and breakage rates, ensuring uniform and reliable performance.
>Easy Wire Winding
The wire pay-off wheel utilizes a universal PV600 reinforced I-wheel spool, eliminating the need for rewinding, thereby ensuring effortless wire management.
>Safety Guarantee
The main operation door, equipped with an electric lift and robust safety mechanism, offers comprehensive safety assurance.
>Wire Break Memory System

>Easy Operation
Open on three sides, the cutting room design allows for straightforward operation and easy maintenance access.



Precision Bar Cutting System for Efficient Semiconductor Cutter ApplicationsPrecision Bar Cutting System for Efficient Semiconductor Cutter Applications
Precision Bar Cutting System for Efficient Semiconductor Cutter ApplicationsPrecision Bar Cutting System for Efficient Semiconductor Cutter ApplicationsPrecision Bar Cutting System for Efficient Semiconductor Cutter Applications

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