Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing Tool

Product Details
Customization: Available
After-sales Service: One Year
Warranty: One Year
Manufacturer/Factory & Trading Company
Diamond Member Since 2024

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  • Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing Tool
  • Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing Tool
  • Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing Tool
  • Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing Tool
  • Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing Tool
  • Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing Tool
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Basic Info.

Model NO.
CHTXQ-690F
Usage
Ceramics, Glass, Jadestone, Granite, Marble
Application
Art & Craft, Construction, Mineral Industry, Stone Industry
Source Voltage
380V
Automation
Automatic
Cutting Ability
High Speed
Control
CNC
Certification
CCC, ISO, CE
Transport Package
Package
Specification
1830*2800*2650mm
Trademark
ChangTong
Origin
China
HS Code
84649010

Product Description

Equipment Use: This advanced model has been meticulously engineered to optimize cutting efficiency for discerning clients. With a substantial roller length of 690mm and a versatile table size of 170/145mm*690mm*160mm*2, it expertly handles the precise cutting of products with thicknesses ranging from a delicate 0.3mm to a robust 65mm.
Introducing the CHTXQ-690F Double Plate Multi-Wire Cutting Machine - Product Features

1. Featuring an innovative design, the four motors independently drive each roller, transforming them into powerful drive shafts. This reduces wear on the steel line against the roller, enhancing roller longevity. The roller bracket boasts a processing center molding, ensuring impeccable spindle installation and coaxial alignment.
2. Equipped with an intuitive LED display, this machine provides clear and direct cutting data insights for enhanced operational efficiency.
3. Ingenious under-table design allows materials to be cut from the bottom up, simplifying the loading and unloading process for seamless operation.
4. Available in two distinctive models: high-speed and standard. The high-speed version surpasses the standard model with faster line speeds and heightened cutting efficiency, enabling the use of thinner diamond lines for identical material cuts.
5. Capable of transverse movement, this versatile table allows back-and-forth motion, facilitating tile cutting and offering an advanced single-line cutting functionality.
6. Boasting an expansive loading area of 170/145mm*690mm*160mm*2, this machine significantly enhances cutting efficiency, accommodating larger material volumes.
7. With spindle accuracy set to an impressive ≤0.01mm, and featuring patented structure dust technology (Pat. No. ZL201320681902.7), it ensures stable operation and effortless disassembly.
8. User-friendly and effortlessly operable, it includes an automatic lifting shield and a fully expandable workbench, simplifying the material and roller loading and unloading process.
  unit parameter
Maximum Worksize mm 170/145*690*160*2
cutting thickness mm 0.6~65
running speed m/min 0~2200
Table lift stroke mm 220
Table cutting feed speed mm/hour 0.1~100
The amount of wire output from the supply wheel Km 30(φ0.2diamond wire)
Diamond diameter mm φ0.06~φ0.35axle
Roller outside diameter*number of axles mm φ155/φ180*690*4
boundary dimension mm ≈1830*2800*2650
machine weight Kg 6500~115000
power   AC380V/50HZ  three-phase four-wire
Total machine power rating Kw 54 above
Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing Tool
This machine excels as a double-station multi-wire cutting marvel, utilizing diamond wire for processing. It adeptly handles two plate materials in one go, with a roller length of 690mm and a maximum cutting area of 220mm*690mm*160mm*2. For hard and brittle materials, it offers both single and multi-line cutting, with blade thicknesses from 0.5mm to 65mm.
Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing ToolThis model is a high-performance multi-line cutting machine designed for diamond line processing, featuring a roller length of 570mm and a maximum cutting area of 220mm*570mm*160mm. Ideal for slicing products with thicknesses between 0.3mm and 65mm, it excels in straight sheet processing of hard and brittle materials.
Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing Tool
Engineered as a compact multi-line cutting solution, this model caters to small batch product processing. With options for single or double stations, it simplifies specification changes and accommodates cutting thicknesses from 0.5mm to 30mm. Perfect for single and multi-line cutting of small batches of hard and brittle materials.
Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing Tool




 

>Stable Wire Web Control
Featuring a cone-positioned structural design, the rollers and wire spools deliver high accuracy and rigidity, minimizing wire web vibrations to ensure stability.
>Optimized Pulley System
Designed with 8 pulleys, this system effectively reduces diamond wire torsion, tension fluctuations, and wire breakage, enhancing durability and performance.
>Easy Wire Winding
The wire pay-off wheel uses the standard universal spool (PV600 reinforced I-wheel), eliminating the need for rewinding, thus offering convenience and efficiency.
>Safety Guarantee
The main operation door is equipped with an electric lift and a robust safety device, ensuring secure and accessible operation.
>Wire Break Memory System.

>Easy Operation
Designed for optimal user experience, the cutting room is accessible from three sides, facilitating easier operation and maintenance.



Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing ToolDiamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing Tool
Diamond Multi-Wire Saw Cutting Machine for Sapphire Silicon Processing Tool

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