Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing Tools

Product Details
Customization: Available
After-sales Service: One Year
Warranty: One Year
Manufacturer/Factory & Trading Company
Diamond Member Since 2024

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  • Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing Tools
  • Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing Tools
  • Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing Tools
  • Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing Tools
  • Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing Tools
  • Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing Tools
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Basic Info.

Model NO.
CHTXQ-690F
Usage
Ceramics, Glass, Jadestone, Granite, Marble
Application
Art & Craft, Construction, Mineral Industry, Stone Industry
Source Voltage
380V
Automation
Automatic
Cutting Ability
High Speed
Control
CNC
Certification
CCC, ISO, CE
Transport Package
Package
Specification
1830*2800*2650mm
Trademark
ChangTong
Origin
China
HS Code
84649010

Product Description

Equipment Use: Discover the pinnacle of precision with our Diamond Wire Cutting Machine, meticulously crafted to elevate cutting efficiency for our most discerning clientele. With a substantial roller length of 690mm and an adaptable table size of 170/145mm*690mm*160mm*2, this powerhouse expertly maneuvers through the delicate precision of products ranging from a mere 0.3mm to an impressive 65mm in thickness.
Introducing the CHTXQ-690F Double Plate Multi-Wire Cutting Machine - Unleashing Exceptional Product Features

1. Innovation meets power with our groundbreaking design, featuring four independently driven motors, each transforming rollers into robust drive shafts. This ingenuity minimizes steel line wear, significantly extending roller longevity. The roller bracket, crafted with precision center molding, ensures flawless spindle installation for unmatched coaxial alignment.
2. Equipped with an intuitive LED display, our machine offers crystal-clear and precise cutting data insights, enhancing operational efficiency beyond expectations.
3. Ingeniously crafted under-table design allows materials to be seamlessly cut from the bottom up, revolutionizing the loading and unloading process into a flawless operation.
4. Choose between two exceptional models: high-speed and standard. The high-speed version propels performance with rapid line speeds and unparalleled cutting efficiency, allowing the use of finer diamond lines for identical material cutting.
5. Experience versatility with transverse table movement, enabling back-and-forth motion for precise tile cutting and advanced single-line cutting capabilities.
6. With a vast loading area of 170/145mm*690mm*160mm*2, this machine redefines cutting efficiency, accommodating larger material volumes effortlessly.
7. Experience precision with spindle accuracy of ≤0.01mm and enjoy the benefits of our patented dust structure technology (Pat. No. ZL201320681902.7), ensuring stable operation and effortless maintenance.
8. Designed for effortless operation, featuring an automatic lifting shield and a fully expandable workbench, simplifying the processes of material and roller loading and unloading.
  unit parameter
Maximum Worksize mm 170/145*690*160*2
cutting thickness mm 0.6~65
running speed m/min 0~2200
Table lift stroke mm 220
Table cutting feed speed mm/hour 0.1~100
The amount of wire output from the supply wheel Km 30(φ0.2diamond wire)
Diamond diameter mm φ0.06~φ0.35axle
Roller outside diameter*number of axles mm φ155/φ180*690*4
boundary dimension mm ≈1830*2800*2650
machine weight Kg 6500~115000
power   AC380V/50HZ  three-phase four-wire
Total machine power rating Kw 54 above
Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing Tools
Master the art of double-station multi-wire cutting with this exceptional machine. Utilizing diamond wire, it proficiently handles two plate materials simultaneously, boasting a roller length of 690mm and a maximum cutting area of 220mm*690mm*160mm*2. Ideal for hard and brittle materials, it excels in both single and multi-line cutting with blade thicknesses from 0.5mm to 65mm.
Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing ToolsThis high-performance marvel, designed for diamond line processing, features a roller length of 570mm and a maximum cutting area of 220mm*570mm*160mm. Perfectly adept at slicing products with thicknesses between 0.3mm and 65mm, it shines in straight sheet processing of hard and brittle materials.
Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing Tools
Crafted as a compact multi-line cutting solution, this model is ideal for small-batch product processing. Offering single or double station options, it simplifies specification changes, accommodating cutting thicknesses from 0.5mm to 30mm. Perfect for single and multi-line cutting of small batches of hard and brittle materials.
Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing Tools




>Stable Wire Web Control
Featuring a cone-positioned structural design, our rollers and wire spools deliver remarkable accuracy and rigidity, effectively minimizing wire web vibrations to ensure unparalleled stability.
>Optimized Pulley System
Our advanced pulley system, designed with eight meticulously engineered pulleys, expertly minimizes diamond wire torsion, tension fluctuations, and wire breakage, significantly enhancing durability and performance.
>Easy Wire Winding
Efficient and convenient, the wire pay-off wheel uses a standard universal spool (PV600 reinforced I-wheel), doing away with the need for rewinding.
>Safety Guarantee
Safety redefined - the main operation door is equipped with an electric lift and a robust safety device, ensuring secure, reliable, and easily accessible operation.
>Wire Break Memory System.

>Easy Operation
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Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing ToolsDiamond Wire Cutting Machine for Efficient Semiconductor Bar Processing Tools
Diamond Wire Cutting Machine for Efficient Semiconductor Bar Processing Tools

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