Green Energy Solutions Utilizing Efficient Semiconductor Cutter Features

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Customization: Available
After-sales Service: One Year
Warranty: One Year
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  • Green Energy Solutions Utilizing Efficient Semiconductor Cutter Features
  • Green Energy Solutions Utilizing Efficient Semiconductor Cutter Features
  • Green Energy Solutions Utilizing Efficient Semiconductor Cutter Features
  • Green Energy Solutions Utilizing Efficient Semiconductor Cutter Features
  • Green Energy Solutions Utilizing Efficient Semiconductor Cutter Features
  • Green Energy Solutions Utilizing Efficient Semiconductor Cutter Features
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Basic Info.

Model NO.
CHTXQ-690F
Type
CNC Cutting Machine
Usage
Ceramics, Glass, Jadestone, Granite, Marble
Application
Art & Craft, Construction, Mineral Industry, Stone Industry
Source Voltage
380V
Automation
Automatic
Cutting Ability
High Speed
Control
CNC
Certification
CCC, ISO, CE
Transport Package
Package
Specification
1830*2800*2650mm
Trademark
ChangTong
Origin
China
HS Code
84649010

Product Description

Equipment Use: Crafted for superior cutting efficiency, this state-of-the-art model showcases a substantial roller length of 690mm, complemented by a meticulously designed table size of 170/145mm*690mm*160mm*2. It is adept at slicing products within a thickness spectrum of 0.3mm to 65mm, establishing it as the premier choice for precision cutting applications.
CHTXQ-690F Double Plate Multi-Wire Cutting Machine Product Features

1. This machine is powered by four independently driven motors that control four rollers, dramatically reducing steel line wear and extending roller life. The precisely engineered roller bracket mounting holes guarantee impeccable alignment of the spindle, ensuring smooth and flawless operation.
2. With an LED display, this machine provides cutting data that is both precise and effortless to interpret, enhancing user experience and operational efficiency.
3. The innovative bottom-up material feeding mechanism simplifies loading and unloading operations, making the entire cutting process remarkably efficient and streamlined.
4. Available in both high-speed and standard models, the high-speed version boasts enhanced line speed and cutting efficiency, enabling the utilization of finer diamond lines for superior results.
5. Featuring transverse movement capabilities, the adaptable table can maneuver back and forth, facilitating tile cutting along with an advanced single-line cutting function.
6. With a spacious loading area of 170/145mm*690mm*160mm*2, this machine significantly amplifies cutting efficiency, catering to high-demand applications with ease.
7. The precision of the spindle is maintained at ≤0.01mm. Its patented dust-proof structural design (Patent No. ZL201320681902.7) ensures exceptional stability and effortless maintenance.
8. User-friendly and efficient, this machine features an automatic lifting shield and a fully expanded workbench, greatly simplifying material and roll handling for enhanced productivity.
  unit parameter
Maximum Worksize mm 170/145*690*160*2
cutting thickness mm 0.6~65
running speed m/min 0~2200
Table lift stroke mm 220
Table cutting feed speed mm/hour 0.1~100
The amount of wire output from the supply wheel Km 30(φ0.2diamond wire)
Diamond diameter mm φ0.06~φ0.35axle
Roller outside diameter*number of axles mm φ155/φ180*690*4
boundary dimension mm ≈1830*2800*2650
machine weight Kg 6500~115000
power   AC380V/50HZ  three-phase four-wire
Total machine power rating Kw 54 above
Green Energy Solutions Utilizing Efficient Semiconductor Cutter Features
This advanced double-station multi-wire cutting machine, equipped with cutting-edge diamond wire processing capabilities, allows users to process two plate materials per cycle. Featuring a roller length of 690mm and an expansive cutting area of 220mm*690mm*160mm*2, the rotary tool holder accommodates blade thicknesses from 0.5mm to 65mm, offering versatile single-line and multi-line cutting for hard and brittle materials.
Green Energy Solutions Utilizing Efficient Semiconductor Cutter FeaturesEngineered as a multi-line cutting machine with diamond line processing, this model features a roller length of 570mm and a maximum cutting area of 220mm*570mm*160mm. The rotary tool holder is ideal for cutting products with thicknesses ranging from 0.3mm to 65mm, perfectly suited for the bulk processing of hard and brittle sheets.
Green Energy Solutions Utilizing Efficient Semiconductor Cutter Features
This compact multi-line cutting machine, available in both single and double station models, is expertly tailored for small batch straight sheet processing. Its versatility allows for swift specification changes, accommodating cutting sheet thicknesses from 0.5mm to 30mm, and supports both single and multi-line functions for handling small batches of hard and brittle materials.
Green Energy Solutions Utilizing Efficient Semiconductor Cutter Features



 

>Stable Wire Web Control
Revolutionary cone-positioned rollers and wire spools provide unparalleled accuracy and rigidity, significantly minimizing wire web oscillation for precision performance.
>Optimized Pulley System
The innovative 8-pulley design skillfully minimizes diamond wire torsion, tension fluctuation, and breakage rates, ensuring consistent and reliable performance.
>Easy Wire Winding
Employing a universal PV600 reinforced I-wheel spool, the wire pay-off wheel eradicates the need for rewinding, offering seamless and effortless wire management.
>Safety Guarantee
The main operation door, equipped with an electric lift and robust safety mechanism, delivers comprehensive safety assurance.
>Wire Break Memory System

>Easy Operation
The cutting room, open on three sides, is designed for straightforward operation and provides easy access for maintenance, enhancing user convenience.



Green Energy Solutions Utilizing Efficient Semiconductor Cutter FeaturesGreen Energy Solutions Utilizing Efficient Semiconductor Cutter Features
Green Energy Solutions Utilizing Efficient Semiconductor Cutter FeaturesGreen Energy Solutions Utilizing Efficient Semiconductor Cutter FeaturesGreen Energy Solutions Utilizing Efficient Semiconductor Cutter Features

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