Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar Applications

Product Details
Customization: Available
After-sales Service: One Year
Warranty: One Year
Manufacturer/Factory & Trading Company
Diamond Member Since 2024

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  • Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar Applications
  • Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar Applications
  • Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar Applications
  • Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar Applications
  • Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar Applications
  • Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar Applications
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Basic Info.

Model NO.
CHTXQ-690F
Type
CNC Cutting Machine
Usage
Ceramics, Glass, Jadestone, Granite, Marble
Application
Art & Craft, Construction, Mineral Industry, Stone Industry
Source Voltage
380V
Automation
Automatic
Cutting Ability
High Speed
Control
CNC
Certification
CCC, ISO, CE
Transport Package
Package
Specification
1830*2800*2650mm
Trademark
ChangTong
Origin
China
HS Code
84649010

Product Description

Equipment use: Specifically engineered to elevate cutting efficiency for our valued customers, this model boasts a roller length of 690mm and a table size of 170/145mm*690mm*160mm*2 version, tailor-made for cutting products with thickness ranging from a delicate 0.3mm to a robust 65mm.
CHTXQ-690F Double Plate Multi-Wire Cutting Machine: Unrivaled Product Features

1. Featuring the precision of four independently driven motors, each roller acts as a drive shaft, significantly minimizing steel line wear on the roller. The robust roller bracket and center-molded mounting holes ensure flawless spindle installation, adhering to stringent coaxial requirements.
2. Equipped with an intuitive LED display, our equipment offers a crystal-clear view of cutting data for enhanced precision and ease of operation.
3. Ingenious design allows material to be cut from bottom-up underneath the table, offering unparalleled convenience in loading and unloading operations.
4. Our machine range includes both high-speed and standard models. The high-speed variant excels with faster line speeds and superior cutting efficiency, enabling the use of thinner diamond lines for the same material.
5. With advanced transverse movement capabilities, the table can glide effortlessly back and forth, enabling tile cutting and single-line cutting functions.
6. The expansive loading area (170/145mm*690mm*160mm*2 version) significantly amplifies cutting efficiency, accommodating a broader range of cutting tasks.
7. Masterful spindle accuracy of ≤0.01mm, coupled with our patented dust structure (patent No. ZL201320681902.7), ensures exceptional stability and effortless disassembly.
8. User-friendly design featuring an automatic lifting shield and fully expandable workbench ensures seamless material and roll handling.
  unit parameter
Maximum Worksize mm 170/145*690*160*2
cutting thickness mm 0.6~65
running speed m/min 0~2200
Table lift stroke mm 220
Table cutting feed speed mm/hour 0.1~100
The amount of wire output from the supply wheel Km 30(φ0.2diamond wire)
Diamond diameter mm φ0.06~φ0.35axle
Roller outside diameter*number of axles mm φ155/φ180*690*4
boundary dimension mm ≈1830*2800*2650
machine weight Kg 6500~115000
power   AC380V/50HZ  three-phase four-wire
Total machine power rating Kw 54 above
Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar Applications
Introducing our Double-Station Multi-Wire Cutting Machine, masterfully engineered for diamond wire processed products, allowing simultaneous processing of two plate materials. With a roller length of 690mm and a maximum cutting area of 220mm*690mm*160mm*2 version, this machine integrates a rotary tool holder for a wide cutting blade range of 0.5mm to 65mm, efficiently enabling both single-line and multi-line cutting for hard and brittle materials.
Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar ApplicationsThis model, a Multi-Line Cutting Machine with diamond line processing prowess, features a roller length of 570mm and a maximum cutting area of 220mm*570mm*160mm. It excels in slicing products from 0.3mm to 65mm in thickness, utilizing a rotary tool holder for seamless batch processing of hard and brittle materials.
Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar Applications
Our compact Multi-Line Cutting Machine, available in both single and double station configurations, is optimized for small batch product processing. The hassle-free replacement of product specifications and versatile cutting capabilities (thickness of 0.5mm to 30mm) ensure efficient single-line and multi-line cutting for small batch hard and brittle materials.
Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar Applications





>Stable Wire Web Control
Our innovative cone-positioned structure for rollers and wire spools ensures unmatched stability, delivering high accuracy and rigidity to suppress wire web shaking.
>Optimized Pulley System
The ingeniously designed 8 pulleys effectively mitigate diamond wire torsion, tension fluctuations, and minimize the risk of wire breakage.
>Easy Wire Winding
Our standard universal spool (PV600 reinforced I-wheel) design for the wire pay-off wheel eliminates the need for rewinding, streamlining the wire winding process.
>Safety Guarantee
Experience peace of mind with our electrically operated main operation door, complete with a robust safety device for enhanced protection.
>Wire Break Memory System

>Easy Operation
The revolutionary design of our cutting room, open on 3 sides, ensures effortless operation and maintenance.



Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar ApplicationsEfficient Diamond Wire Cutting Machine for Semi-Conductor Bar Applications
Efficient Diamond Wire Cutting Machine for Semi-Conductor Bar Applications

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